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专利名称：Method of constructing a high performance
printed circuit board assembly
发明人：Wiley, John Pennock申请号：EP103031.4申请日：190222公开号：EP03328B1公开日：19950118
摘要：The invention features a method of constructing a high performance printedcircuit board assembly utilizing a modular construction technique. Sub-assemblies (10)are first constructed, tested, and then subsequently incorporated into the final circuitboard assembly (20) which has a triplate geometry. Lamination of the modular sub-assemblies minimizes dielectric core thickness.
申请人：IBM
地址：US
国籍：US
代理机构：Kirchhof, Norbert
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