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专利名称：Integrated circuit package and method of
making
发明人：Lee Han Meng@Eugene Lee,Sueann Lim Wei
Fen,Sarel Bin Ismail
申请号：US13734402申请日：20130104公开号：US09013028B2公开日：20150421
专利附图：
摘要：An integrated circuit (“IC”) device and method of making it. The IC device mayinclude a conductive lead frame that has a die pad with a relatively larger central body
portion and at least one relatively smaller peripheral portion in electrical continuity withthe central body portion. The peripheral portion(s) project laterally outwardly from thecentral body portion of the die pad. Lateral displacement of a portion(s) of an
encapsulation layer overlying the peripheral portion(s) is resisted by abutting surfaces onthe peripheral portion(s) and the encapsulation layer.
申请人：Texas Instruments Incorporated
地址：Dallas TX US
国籍：US
代理人：Steven A. Shaw,Frank D. Cimino
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