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专利名称：Die bonder
发明人：Yuichi Kubo,Masateru Osada,Masayuki
Azuma
申请号：US10663726申请日：20030917
公开号：US200400657A1公开日：20040408
摘要：The die bonder which mounts dies piece by piece on a base has a laser
machining part which causes laser light to become incident from the obverse surface of awafer and forms a modified region in the interior of the wafer. In this manner, the diebonder itself has the function of dividing the wafer into individual dies. Thus, the dicingstep before the die bonding step can be omitted.
申请人：TOKYO SEIMITSU CO., LTD.
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